OCP maps open specifications for AI data centers, networking, and chiplets
The Open Compute Project Foundation published a technical progress report linking specifications and white papers for data-center power, cooling, telemetry, Ethernet scale-up networking, and chiplet systems. It highlights ESUN, SUE-T, Foundation Chiplet System Architecture, and BoW.Flexi 1.0, alongside open rack designs. The report identifies further work on co-optimizing silicon and facility infrastructure and on open platforms for inference beyond hyperscale campuses. This is a roadmap and reference roundup; the linked specifications have their own earlier publication dates.